
Rev.0.10 Mar 4, 2004 Page 16 of 16
REJ03B0078-0010Z
R8C/15 Group Package Dimensions
Under development
Preliminary specification
Specications in this manual are tentative and subject to change.
Package Dimensions
SSOP20-P-255-0.65
Weight(g)
––
JEDEC Code
EIAJ Package Code
Lead Material
Cu Alloy
20
P
2
F
-
A
P
l
as
t
i
c
20
pin
255
m
il
SSOP
Symbol
Min Nom Max
A
A
2
b
c
D
E
L
L
1
y
Dimension in Millimeters
H
E
A1
I2
–
–
.170
0
.130
.46
.34
–
.26
.30
–
–
–
.01
.10
–
.151
.220
.150
.56
.44
.650
.46
.50
.01
–
.85
–
.20
.451
–
.320
.20
.66
.54
–
.66
.70
–
.10
–
b
2
–.350–
–
0 – 10
e
e1
e
b2
e1
I2
Recommended Mount Pad
x
–
–
Z1
–
0.325
–
–
–
0.475
0.13
z
Recommended
20 11
10
1
HE
E
D
e
y
F
A
A
2
A1
L1
L
c
Detail F
G
b
x
M
Detail F
z
Z1
SDIP20-P-300-1.78
Weight(g)
–
JEDEC Code
1.0
EIAJ Package Code
20
P
4
B
P
l
as
t
i
c
20
pin
300
m
il
S
D
IP
Symbol
Min Nom Max
A
A
2
b
b
1
c
E
D
L
Dimension in Millimeters
A
1
0.51 – –
– 3.3 –
0.38 0.48 0.58
0.9 1.0 1.3
0.22 0.27 0.34
18.8 19.0 19.2
6.15 6.3 6.45
– 1.778 –
– 7.62 –
3.0 – –
0 – 15
– – 4.5
e
e1
20
11
10
1
E
c
e
1
A2
A1
b
b
1
e
LA
SEATING PLANE
D
Lead Material
Alloy 42/Cu Alloy
Recommended
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