Renesas Single-Chip Microcomputer M37900T2-RPD-E Información técnica Pagina 17

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Chapter 2. Preparation
This chapter describes the package components, the system configuration and the preparation for using this product for the
first time.
2.1 Terminology ............................................................................................................................... 16
2.2 Package Components.................................................................................................................. 17
2.3 Other Tool Products Required for Development........................................................................ 17
2.4 System Configuration ................................................................................................................. 18
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